DA NANG (July 24, 2026) During a working visit by the Singapore Semiconductor Industry Association (SSIA) to Da Nang, Thanh Binh Phu My Joint Stock Company (TBPM), the infrastructure developer of Hoa Ninh - Phu My 3 Da Nang Industrial Park (IP) and FTZ Phu My 3 Da Nang officially signed a Memorandum of Understanding (MOU) with the SSIA. The event paves the way for connecting Singaporean semiconductor enterprises with Da Nang's emerging industrial ecosystem, with a specific focus on industrial park infrastructure, investment promotion, and the development of the semiconductor value chain.
On the morning of July 24, Vice Chairman of the Da Nang People's Committee, Mr. Ho Quang Buu, chaired a working session with the SSIA delegation, which was led by Mr. Ang Wee Seng, the Association’s Executive Director. The session was attended by representatives of municipal departments and agencies, the University of Da Nang, the local business community, and the Vietnamese Embassy in Singapore. Discussions centered on introducing the local investment climate, accelerating collaboration in semiconductor development, training human resources, and facilitating business matchmaking between Da Nang and Singapore.
Mr. Doan Anh Hung, representing Thanh Binh Phu My JSC, signs the cooperation agreement with Mr. Ang Wee Seng, representing the Singapore Semiconductor Industry Association (SSIA).
As part of the program, the SSIA signed collaborative MOUs with several key municipal agencies, institutions, and prominent local enterprises, including Thanh Binh Phu My JSC, which represented the industrial park infrastructure development sector. This milestone occurs as Da Nang intensifies its efforts to build a high-tech ecosystem driven by three strategic pillars: IC design, the semiconductor industry, and artificial intelligence (AI).
For Thanh Binh Phu My, the MOU with the SSIA serves as a strategic bridge to a premier network of semiconductor firms in Singapore and the broader region, ranging from manufacturers and supply chain vendors to international technology partners. Through this alliance, Hoa Ninh - Phu My 3 Da Nang IP and FTZ Phu My 3 Da Nang will gain early access to investors with active expansion needs. This marks a strategic shift in their investment promotion approach, moving from one-way broadcasting to direct, targeted dialogues with the market.
Beyond direct access to investors, the partnership with the SSIA will enable Thanh Binh Phu My to deepen its presence at specialized domestic and international forums, thereby elevating its brand profile on the regional semiconductor investment map. Concurrently, linkages in human resource training and development will help businesses operating within TBPM's industrial parks gradually secure a high-quality workforce capable of meeting the stringent demands of the semiconductor sector.
Mr. Doan Anh Hung, representing Thanh Binh Phu My JSC, exchanges the signed Memorandum of Understanding with Mr. Ang Wee Seng, representing the Singapore Semiconductor Industry Association (SSIA).
This agreement is more than just a symbolic document; it represents a concrete step in helping Thanh Binh Phu My bolster its capacity to attract investment, broaden its international partner network, and cement its position within the emerging semiconductor ecosystem of Central Vietnam.
For TBPM, the MOU is a tangible realization of its regional development strategy, reaffirming the role of Hoa Ninh - Phu My 3 Da Nang IP and FTZ Phu My 3 Da Nang as strategic destinations for global semiconductor enterprises. Leveraging its extensive experience in industrial infrastructure development and a long-term vision, TBPM anticipates this collaboration will drive high-quality Foreign Direct Investment (FDI) inflows, contributing to Da Nang’s rise as a new regional semiconductor hub while reinforcing bilateral economic ties between Vietnam and Singapore.